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2023 5th International Conference on Electronic Engineering and Informatics (EEI 2023)

※ Important Information ※ 

Official Website:

Place: June 23-25, 2023, Wuhan, China 

Submission Deadline: March 15, 2023

Notice of Acceptance/Rejection: within one week after 

Submission Retrieval: Ei Compendex, Scopus

※ Introduction ※ 

The 2023 5th International Conference on Electronic Engineering and Informatics (EEI 2023) will be held on June 23-25, 2023 in Wuhan, China. EEI 2023 is to bring together innovative academics and industrial experts in the field of  Electronic Engineering and Informatics to a common forum. The primary goal of the conference is to promote research and developmental activities in  Electronic Engineering and Informatics, and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in  Electronic Engineering and Informatics and related areas. 

※ The conference is soliciting state-of-the-art research papers in the following areas of interest but not limited to:

Topic 1: Electronic Technology

  • 3D process and integration technology

  • Substrate embedding and advanced flip chip packaging

  • MEMS and sensor technology

  • Wafer-level CSP and heterogeneous integration

  • Design and Analysis of Transmission System

  • New materials, equipment and 3D interconnection

  • Wearable, flexible and stretchable electronics

  • Optical interconnection and 3D photonics

  • Digital system and logic design

  • Computer architecture and VLSI

  • Network-driven multi-core chip

  • Advanced robotic system

  • Motor

  • Analog and digital electronics

  • Signals and Systems

Topic 2: Information and Communication

  • Electronic equipment

  • Satellite and Space Communications

  • Network and Information Security

  • Signal processing for wireless communication

  • Cognitive Radio and Software Radio

  • Optical networks and systems

  • Electromagnetic field theory

  • Antenna, propagation and transmission technology

  • Optical communication

  • Radar signal and data processing


  • 3D流程和集成技术

  • 基板嵌入和先进的倒装芯片封装

  • MEMS和传感器技术

  • 晶圆级CSP和异构集成

  • 输电系统的设计与分析

  • 新型材料,设备和3D互连

  • 可穿戴,灵活和可伸展的电子产品

  • 光学互连和3D光子学

  • 数字系统与逻辑设计

  • 计算机体系结构和VLSI

  • 网络驱动的多核芯片

  • 先进的机器人系统

  • 电机

  • 模拟和数字电子

  • 信号与系统


  • 电子设备

  • 卫星与太空通讯

  • 网络与信息安全

  • 无线通信的信号处理

  • 认知无线电和软件无线电

  • 光网络和系统

  • 电磁场理论

  • 天线,传播和传输技术

  • 光通讯

  • 雷达信号与数据处理


※ Publication ※

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.

※ Registration ※ 

For the publication on conference proceedings:

ItemsRegistration Fee
Regular Registration for Paper (4 pages)

550 USD/ paper (4 pages)

3800 CNY/ paper (4 pages)

student Registration ≥ 3

500 USD/ paper (4 pages)

3400 CNY/ paper (4 pages)

Extra Pages (Begin at Page 5)

60 USD/ extra page

400 CNY/ extra pag

Attendees without Submission

180 USD/ person

1200 CNY/ person

Attendees without Submission (Groups)

150 USD/ person(≥ 3 person)

1000 CNY/ person(≥ 3 person)

Purchase Extra Journal75 USD/book

500 CNY/book


※ Contact Us ※ 

Conference Secretary: Yasmin

Tel: +86-13502443374 (Wechat)

QQ: 779188085




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