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2024 8th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2024)

November 22-24, 2024     Dalian, Liaoning, China



标题.pngImportant Information

Conference Website: www.icmmap.com

Date: November 22-24, 2024

Location: Dalian, Liaoning, China

1st Submission Deadline: June 30, 2024

Submit to database: SCI, EI Compendex, Inspec, Scopus



标题.pngConference Introduction

Host: Dalian Jiaotong University

Supporters: School of Science, Dalian Jiaotong University

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Previous ICMMAP conferences have been held successfully. The history of the conference is as follows: 

The 1st conference (ICMMAP 2017) was held on November 24-26, 2017 in Hohhot, Inner Mongolia, China. 

The 2nd conference (ICMMAP 2018) was held on July 28-30, 2018 in Zhuhai, Guangdong, China. 

The 3rd conference (ICMMAP 2019) was held on July 26-28, 2019 in Guilin, Guangxi, China. 

The 4th conference (ICMMAP 2020) was held on July 17-19, 2020 in Lanzhou, Gansu, China (both online and offline). 

The 5th conference (ICMMAP 2021) was held on July 23-25, 2021 in Nanjing, Jiangsu, China (both online and offline). 

The 6th conference (ICMMAP 2022) was held on August 19-21, 2022 in Qingdao, Shandong, China (both online and offline). 

The 7th conference (ICMMAP 2023) was held on September 8-10, 2023 in Dalian, Liaoning, China.


To exchange the latest progress in theory, technology and application in the field of mechanics, mathematics and applied physics in foreign countries in recent years and to show the latest achievements, 2024 8th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2024) will be held in Dalian, Liaoning, China on November 22-24, 2024.



标题.pngCall for Paper

Topics include but are not limited to the following areas:

1. Mechanics (Applied mechanics/analytical mechanics/computational mechanics/fluid mechanics/explosion mechanics/vibration/geomechanics/geodynamics/rotor dynamics/soil mechanics/plastic fracture and damage mechanics/force analysis/mechanics and mechanical production, etc.)

2. Mathematics (Data Analysis/Statistics and Bayesian Principle/Riemann Surface and Riemann Geometry/Preliminary Algebraic Topology/Parametric Computation/Statistical Analysis/Mathematical Modeling/Lie Groups and Representations/Linear Algebra/Matrices/Vector Analysis/Complex Variable Analysis/Differential Equations/Laplace Transforms/Fourier Analysis/Combinatorial Mathematics/Functional Theory/Discrete Mathematics, etc.)

3. Physics (Condensed matter physics and new materials/physics and applied physics/nuclear physics/acoustic/electrical/optical/thermal science/atomic physics/solid state physics/structure and physical properties/electrical and electronic technology/semiconductor physics/optoelectronics/optoelectronic technology and its applications/nuclear electronics/nuclear technology and applications/vibration/noise and its control/electroacoustic technology/circuit principles and analysis/quantum electronic informatics/optical quantum informatics/space science and technology, etc.)

4. Application Areas (Astronomy and Earth Sciences/Precision Agriculture/Aerospace/Automotive Industry/Chemical and Petroleum Engineering/Military and Defense/Construction Engineering and Project Management/Telecommunications Systems and Networks/Energy and Power Systems/Electronics Design and Manufacturing/Industrial Processes/Healthcare/Logistics/Traffic and Transportation/Robotics/Automation and Mechatronics/Hydraulic and Pneumatic Systems/Materials/Sports/Wireless Systems/Urban and Regional Planning and Engineering/GIS/GPS Systems, etc.)

More topics: www.icmmap.com/call_for_paper



标题.pngPublication & Submission

1. Conferece Proceedings

All accepted full papers will be published by conference proceedings and will be submitted to EI Compendex, Inspec, Scopus for indexing.

◆ The paper should be more than 5 pages.

◆ Template & Submission: Download

◆ Online Submission: https://paper-sub.com/paper/ZAE6ZF

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2. SCI Journals

Journal 1: Science of Advanced Materials(ISSN :1947-2935, IF=1.067, CAS Q4) 

Journal 2: MATERIALS EXPRESS(ISSN :2158-5849, IF=1.65, CAS Q4) 

Journal 3: IET Image Processing(ISSN :1751-9659, IF=1.773, CAS Q4)

◆ Online Submission: www.ais.cn/sciPaperPro/contribute/147/1

◆ Invitation code: L162



标题.pngConference Program

November 22 (Fri.)13:00-18:00Registration
November 23 (Sat.)09:00-12:00Opening Ceremony, Keynote Speech
12:00-14:00Lunch
14:00-18:00Oral Presentation
18:00-19:30Banquet
November 24 (Sun.)09:00-18:00Academic tour

* The above program is a brief outline. A more detailed programme will be emailed to you after the registration deadline. The actual conference schedule may be a little different according to the number of participants.



标题.pngRegistration

ItemRegistration Fee
Conference Proceedings Paper (5-6 pages)540 USD/ paper (5-6 pages)
Extra Pages (Begin at Page 7)40 USD/ extra page
Attendees without Submission170 USD/per person
Attendees without Submission (Groups≥ 3 people)140 USD/per person
Purchase Extra Journal70 USD/book

* If your paper is accepted by committee and you registered for the conference, a 30% processing fee will be deducted if a retraction is requested.



标题.pngParticipation

1. Paper Authors: The edition fee includes a free place to attend the conference. The other authors can register as normal participant. All the authors can apply the presentation for free.

2. Keynote Speaker: Apply for the keynote speech on the conference. Please submit your personal CV, presentation title and abstract.

3. Oral Presenter: Apply for the oral presentation on the conference. Please submit your presentation title and abstract.

4. Poster Presentation: Apply for print the poster and the poster will be shown on the conference hall. Please submit the A1 vertical and electronic version.

5. Audience Participation: No submission but only participation.



标题.pngContact Us

Conference Secretary: Mr. Li

Tel: 13922150148 (WeChat)

Conference Website: www.icmmap.com

E-mail: ic_mmap@163.com

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Mr. Li's WeChat QRCode





Contents

  • Conference details
  • Recent Participants
  • Recommended References
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