2023 3rd International Symposium on Mechanical Systems and Electronic Engineering                                                                    (ISMSEE 2023)

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers  will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

Important information
Conference Dates:July 28 to 30, 2023
Conference Venue: Dali· China
Full Paper Submission Date: February 28,2023
Notification of Acceptance Date: Within one week of submission
Index：EI-Compendex、Scopus


About ISMSEE 2023 
2023 3rd International Symposium on Mechanical Systems and Electronic Engineering (ISMSEE 2023) will be held in Dali from July 28 to 30, 2023. The conference will focus on topics such as "mechanical system dynamics", "mechanical transmission and system measurement and control", "telecommunication engineering" and "computational engineering", aiming to provide a platform for scientific research scholars, technicians and related personnel engaged in mechanical system and electronic engineering to share scientific research achievements and cutting-edge technologies, understand academic development trends, broaden research ideas, strengthen academic research and discussion, and promote industrial cooperation of academic achievements. Experts, scholars, business people and other relevant personnel from universities and research institutions at home and abroad are cordially invited to attend and exchange.



Committee

Program Committees
Assoc. Prof. Wei Jiang
Huazhong University of Science and Technology, China



Assoc Prof. Wei Jiang
Huazhong University of Science & Technology, China




Prof. Pramod Kumar Singhal
Department of Electronics, Madhav Institute of Technology & Science, Gwalior, India

Prof. Jiang Zhu
Department of Mechanical Engineering, Tokyo Institute of Technology, Japan


Prof. Anil L. Wanare
JSPM’s BSIOTR, Wagholi, India

Keynote Speakers
Prof. Hong Huang
Chongqing University
Experience:
Prof. Huang Hong,doctoral supervisor, director of the Department of Measurement and Control Technology and Instrument of Chongqing University, head of the Image Information Processing Research Office, national first-class undergraduate major, and the characteristic major of "big data intelligence" in Chongqing. He is a member of the Organizing Committee of the China EU "Dragon Plan", an expert in the evaluation of the Ministry of Science and Technology, an expert in the evaluation of the Degree Center of the Ministry of Education, a special expert in civil air defense in Chongqing, a guest editor in chief of Frontier in Oncology, and a guest editor of Applied Sciences.

Mainly engaged in image processing and pattern classification, target detection and recognition research, and relevant achievements have been applied in remote sensing observation, medical diagnosis, process industry and other fields. In recent years, he has presided over three national natural science projects, national key research and development projects, major consulting projects of the Chinese Academy of Engineering, special projects for common key technology innovation in Chongqing's key industries and other scientific and technological projects. As the first/corresponding author in IEEE TNNLS, IEEE Trans More than 50 SCI academic papers have been published in international well-known academic journals such as Cybernetics, Pattern Recognition, etc. Google has cited more than 2000 times in total, of which 3 were selected as high cited papers of ESI. He has won the second prize of China Machinery Industry Science and Technology Progress Award, Huawei Scholarship, Chongqing Excellent Doctoral Thesis Instructor, the most popular teacher of Chongqing University and other honors, and guided students to win the second place in the medical and health track of the "2020 SEED Big Data Development and Application Competition" (650 teams).

Professor Dr. Subhas Mukhopadhyay，FIEEE (USA), FIET (UK), FIETE (India)
Distinguished Lecturer – IEEE Sensors Council
School of Engineering, Macquarie University, NSW 2109

Experience:
Subhas holds a B.E.E. (gold medallist), M.E.E., Ph.D. (India) and Doctor of Engineering (Japan). He has over 31 years of teaching, industrial and research experience.
Currently he is working as a Professor of Mechanical/Electronics Engineering, Macquarie University, Australia and is the Discipline Leader of the Mechatronics Engineering Degree Programme. His fields of interest include Smart Sensors and sensing technology, instrumentation techniques, wireless sensors and network (WSN), Internet of Things (IoT), Mechatronics etc. He has supervised over 45 postgraduate students and over 150 Honours students. He has examined over 75 postgraduate theses.

He has published over 450 papers in different international journals and conference proceedings, written ten books and fifty two book chapters and edited eighteen conference proceedings. He has also edited thirty five books with Springer-Verlag and thirty two journal special issues. He has organized over 20 international conferences as either General Chairs/co-chairs or Technical Programme Chair. He has delivered 402 presentations including keynote, invited, tutorial and special lectures.
He is a Fellow of IEEE (USA), a Fellow of IET (UK), a Fellow of IETE (India). He is a Topical Editor of IEEE Sensors journal. He is also an associate editor of IEEE Transactions on Instrumentation and Measurements and IEEE Reviews in Biomedical Engineering (RBME). He is a Distinguished Lecturer of the IEEE Sensors Council from 2017 to 2022. He chairs the IEEE Sensors Council NSW chapter.

Prof. Hongtao Tang ，Hunan University, China
Experience:
Hongtao Tang Associate Professor/doctoral supervisor of Wuhan University of Technology, deputy director of the Department of Industrial Engineering. In recent years, he is mainly engaged in digital design, intelligent manufacturing, intelligent optimization and application in manufacturing industry (automotive, hydraulic cylinder, mold, casting and other industries); developed digital design software applicable to automotive, hydraulic cylinder, mold, casting and other industries, developed intelligent manufacturing PLM/ERP/MES industrial software, which has been applied in many companies in different industries and achieved great economic benefits. Received one second prize of Hubei Provincial Science and Technology Progress (ranked 2/10). He has presided over 2 national natural science funds and 2 youth funds, and more than 20 horizontal projects with a total funding of more than 8 million. He has published more than 60 academic papers, including more than 20 SCI papers, one English monograph, 19 soft books, and 13 invention patents. He is a reviewer of more than 30 international journals such as IEEE, IJPR, JCLP, CAIE, JIM, ASOC, COR, etc. He has been awarded excellent paper award 4 times and Kenote speaker report 5 times. He is a reviewer of industrial intelligent transformation, industrial internet and digital economy for Wuhan Municipal Bureau of Economic and Information Technology.


Technical Program Committees
Dr. Jahariah Sampe from UKM, Malaysia.
Dr. Mohammad Faseehuddin from Faculty of Engineering, Symbiosis International University (SIU), Pune, Maharashtra, India.
Dr. Lee Hwang Sheng from Universiti Tunku Abdul Rahman (UTAR), Malaysia.
A. Prof. MRUTYUNJAY MAHARANA from Xi'an Jiaotong University, China.
Dr. Tirupati S from Universiti Tenaga Nasional Malaysia.


Topics
Mechatronics
Electronics
Microfabrication Theory
Computer Architecture
Mechanical Measurement, Control and Automation
Microelectronic System
Bio-mechatronics
Analog Integrated Circuit Design
Fluid Drive and Control Technology
Mixed-signal Integrated Circuit Design 
Artificial Intelligence
Man-machine Interaction System
Electromechanical and Composite Drives
Electronic Material
Drive Train Dynamics
Control and Computer Systems
Vehicle Power Transmission and Control
Nonlinear Random Control
Drive Train Manufacturing Process
Process Optimization and Scheduling
CNC Machine tool Reliability Technology Research
Control and Intelligent Systems
MEMS Dynamics
Artificial Intelligence Expert System
Rigid-flex Coupling Dynamics
Fuzzy Logic and Neural Networks
Mechanical Design, Manufacturing and Automation
Optimal, Robust and Adaptive Control
Mechanical System Dynamics and Control
Telecommunications Engineering
Flexible Cellular Mechanism Dynamics
Embedded System
Optoelectronics Integrated Manufacturing and Intelligence
Wireless and Mobile Communications
Vibration, Shock and Noise Theory, Application and Control
Communications Electronics and Microwave
Micromachining Platform
Distributed Platform (computing)
Digital Prototyping and Virtual Reality
Communications Networks and Systems
Manufacturing Systems and Manufacturing Quality Control
Telematics Services
Nonlinear Vibration, Modal Analysis and Parameter Recognition
Radio Communications
Active, Passive and Intelligent Control of Vibration, Shock and Noise
Real-time Imaging and Video Processing
Vibration and Control of Rotating Machinery
CMOS Image Sensor
Automotive Dynamics and Intelligent Suspension Systems
Imaging System Design and Instrumentation
High-Precision, high-acceleration Motion Systems and Controls
Computer Engineering
Numerical Design Theory and Simulation
Communication Modulation and Signal Processing
Modern Signal Processing, Information Fusion and Data Mining
Parallel Distributed Computers
Manufacturing Process Simulation and Quality Control
Electromagnetic Compatibility
Mechanical Drives and Systems Measurement and Control
High Voltage Insulation Technology
Design Theory and Methods for Complex Electromechanical Products
Human-computer Interaction
Machining, Forming Theory and Process Control
Virtual/Augmented Reality
Condition Monitoring, Fault Diagnosis and Intelligent Maintenance Systems
VLSI Design - Network Traffic Modeling
Signal Processing and Intelligent Maintenance of Mechanical Systems
Performance Modeling
Fault Diagnosis and Intelligent Maintenance of Machinery and Equipment
Electric Motors and Appliances
Modeling Complex Product Assemblies and Diagnosing Error Sources
Bio-signal Processing
Design and Implementation of Application Specific Integrated Circuits (ASICs)
Reliable Calculations and High Performance Computing
Topics include but are not limited to the following areas

Submission
1. The submitted papers must not be previously published or under consideration of publication elsewhere.
2. Please submit your full paper (Word+pdf) to  Oversea Authors: English SUBMISSION SYSTEM 
3. And please submit the full paper if both the presentation and publication are needed.
4. Please submit the Abstract only if you just want to make a presentation.
5. Templates download:  
6. Should you have any questions or you need any information in English, please contact us at icamce2023@163.com

Note: 
1)  The author can make an Oral Presentation or Poster Presentation after the Abstract is accepted and the payment is made.
2) All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.


Program
                                                                                 Program
July 28
13:00-17:00
Registration
July 29
09:00-12:00
Speeches of Keynote Speakers
12:00-14:00
Lunch
10:00-10:20
Oral Presentations
18:00-19:30
Banquet
July 30
09:00-18:00
Academic Investigation

Registration
Items 
Registration Fee
Regular Registration(4 -6 pages)
490 USD/ paper (6 pages)
3400 CNY/ paper (6 pages)
Student Registration
440 USD/ paper (6 pages)
3000 CNY/ paper (6 pages)
Extra Pages (Begin at Page 7)
50 USD/ extra page
300 CNY/ extra page 
Attendees without a Submission
180 USD/ person
1200 CNY/ person
Attendees without a Submission (Groups）
150 USD/ person（≥ 3 person）
1000 CNY/ person（≥ 3 person）
Purchase Extra Proceedings/Journal copies
75 USD/ book
500 CNY/ book


VISA/MasterCard/Paypal              

Details of the attending registration
Join as a Presenter: If you are only interested in giving a presentation at the conference without publishing your paper in the proceedings, you can choose to attend ISMSEE 2023 as a Presenter. As a presenter, you need to submit the Abstract and Title of your presentation during the registration. For further information, please contact us at: 
icamce2023@163.com
Join as a Listener:  ISMSEE 2023 is an unmissable conference. It is a good chance and an effective platform for you to meet many renowned experts and researchers in the field of the latest academic research. You are welcome to attend this great event. You just need to complete the registration as a Listener before the registration deadline.


Contact

Conference Secretary: Serena Lu 
E-mail: icamce2023@163.com
Tel: +86-139 2215 1347 (WeChat)
QQ: 564573170