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2022 International Conference on Materials Engineering And Applied Mechanics (ICMEAAE 2022)

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▶▶General Infomation

point8_7s.png  Website:www.icmeaae.org

point8_7s.png  Location:Changsha,China

point8_7s.png  Conference Dates: April 8-10, 2022

point8_7s.png  Registration/Submission Deadline: April 3, 2022

point8_7s.png  Notification of Acceptance: Within one week of submission

point8_7s.png  Submitted to these indexers:EI, Scopus


▶▶About ICMEAAE 2022

As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. These endeavors have made new contribution to globalization and creating a community of shared future.


2022 International Conference on Materials Engineering And Applied Mechanics (ICMEAAE 2022) will be held on April 8-10, 2022, in Changsha, China.ICMEAAE 2022 provides an enabling platform for  Materials Engineering And Applied Mechanics experts to exchange new ideas and present research results. This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field. 


▶▶Keynote Speakers


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Prof. Ming Liu,Fuzhou University, China

Title: 

Characterizationofresidualstressandmicro-mechanicalpropertiesbyinstrumentedindentation

Abstract: 

Hardness, elastic modulus, yield strength, work hardening exponent, and residual stress within shot-peened layer of nickel-based single crystal superalloy DD6 were experimentally obtained by nanoindentation under a maximum load of 100 mN. The residual stresses calculated by different models have similar variation with the depth, but the values differ significantly with Wang’s model most suitable for shot-peened DD6. It is found: the maximum residual compressive stress is 1.23 GPa at the depth of 40 μm; and the total depth of residual compressive stress layer is 140 μm. Mechanical properties such as indentation hardness and yield strength are affected by residual stress, which has little effect on elastic modulus. The effects of residual stress on various indentation parameters such as indentation work/displacement and contact depth/stiffness were quantified by linear expressions. The microstructural change in the shot-peened layer was found to be associated with the distribution of residual stress.

Experience:

Prof.Ming Liu, doctoral supervisor, "distinguished professor of Minjiang scholars" in Fujian Province in 2015.

Study abroad evaluation experts sent by the national study abroad fund commission

Review expert of special talent training project and local cooperation project in Western China of NSFC

Executive director of Fujian mechanical Society

Editorial board of nanotechnology and precision engineering

Research Area and Grant:

Micromechanical characterization by nanoindentation and microscratch techniques.

Finite element analysis of multi-physics and contact problems by ABAQUS.

National Natural Science Foundation of China (Grant No. 51705082), 2018-2020.

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Prof.Hongwen Huang,Hunan University, China


Title: 

Rational Design of Pt-based Ultrathin Nanowires for Proton-Exchange Membrane Fuel Cell

Abstract: 

Exploring the electrocatalysts with simultaneously improved mass activity and catalytic stability has hold the key to the large-scale commercialization of PEMFCs. One-dimensional (1D) ultrathin Pt-based nanowires (NWs) have shown great promise to concurrently address the issues of insufficient ORR activity and durability owing to the inherent advantages from the unique structure. In this talk, I will present our recent studies on the Pt-based nanowires, ranging from the fundamental understanding to the catalyst design.

Experience:

Hongwen Huang is a full professor at Hunan University. His research interests include the controlled growth of nanocrystals and their applications in energy-related electrocatalysis. To date, he has published more than 60 SCI papers and 8 patents. Also, he has hold more than 10 research projects from MOST, NSFC, and so on.

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Prof. Ke Shen,Hunan University, China


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Prof. Hailiang Yu,Central South University, China


Title: 

Crack-free nonferrous metal strips by using cryorolling

Abstract: 

Cracks often appear in nonferrous metal strips such as Al/Ti lamiantes, Al/HEAp composites and Cu-Ni-Sn alloys during cold rolling. Thus, people generally used hot rolling technique to process them. However, the hot-rolled strips have low surface quality as well as low mechanical properties. In this report, I will introduce the progress in nonferrous metals (Al, Cu, Ti) development via cryorolling. The cryorolling can refine the grain size of materials, improve the mechanical properties of alloys, enhance the high-temperature plasticity of materials, reduce the residual stress in strips. Finally, I will focus on the introduction of the application of cryorolling in processing the laminate, Al/HEAp and Cu-Ni-Sn alloy strips. The crack-free strips and composites can be produced by using cryorolling while the cracks appear in strips when using cold rolling.

Experience:

Cracks often appear in nonferrous metal strips such as Al/Ti lamiantes, Al/HEAp composites and Cu-Ni-Sn alloys during cold rolling. Thus, people generally used hot rolling technique to process them. However, the hot-rolled strips have low surface quality as well as low mechanical properties. In this report, I will introduce the progress in nonferrous metals (Al, Cu, Ti) development via cryorolling. The cryorolling can refine the grain size of materials, improve the mechanical properties of alloys, enhance the high-temperature plasticity of materials, reduce the residual stress in strips. Finally, I will focus on the introduction of the application of cryorolling in processing the laminate, Al/HEAp and Cu-Ni-Sn alloy strips. The crack-free strips and composites can be produced by using cryorolling while the cracks appear in strips when using cold rolling.


▶▶Call For Paper


Topics of interest for submission include, but are not limited to:

MaterialsApplied Mechanics
  • Materials Science and Engineering

  • Nanomaterials

  • New Energy Materials

  • Electronic and Magnetic Materials

  • Composite, hybrid and multifunctional materials

  • Metals and alloys

  • Environmentally friendly green materials

  • Nanoporous materials

  • Polymer Materials

  • Optical/photovoltaic materials

  • Silicon Materials

  • Materials Synthesis and Processing Processes

  • Basic Materials Science

  • Material Surfaces and Interfaces

  • Materials Failure and Protection

  • Vibration Science

  • Contact mechanics / elasticity / solid mechanics / hydrodynamics / rheology / structural mechanics

  • Particle mechanics

  • fracture mechanics 

  • boundary layer

  • Multiphase flow

  • wave propagation

  • Welded connection

  • Heat and mass transfer

  • Experimental mechanics of engineering structure

  • Renewable energy mechanics

  • surface engineering 

  • Material modeling

  • plasticity

  • Fracture and damage mechanics / computational mechanics / rolling mechanics

  • Material properties

  • Measurement method and application


▶▶Publication

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All accepted full papers will be published by Journal of Physics: Conference Series (ISSN: 1742-6588), and then submit to EI Compendex, Scopus


Note: All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.


▶▶Submission Methods

1.The submitted papers must not be under consideration elsewhere.

2.Please send the full paper(word+pdf) to  SUBMISSION SYSTEM

◆ Online submission :【AIS online submission.CN】

◆Online submission:【AIS online submission.EN】

3.Please submit the full paper, if presentation and publication are both needed.

4.Please submit the abstract only, if you just want to make presentations.

5.Templates Download: Templates

6.Should you have any questions, or you need any materials in English, please contact us at icmeaae@163.com


Note: 

1) Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is finished.

2) All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.


▶▶Schedule


Schedule
April 813:00-17:00Registration
April 909:00-12:00Speeches of Keynote Speakers
12:00-14:00Lunch
14:00-17:30Oral Presentations
18:00-19:30Banquet
April 1009:00-18:00Academic Investigation


* The outline program is shown on this page. A more detailed programme will be emailed to you after registration deadline. Actual time arrangement may be a little different according to participant numbers.


Oral Presentation Instruction

1. Timing: a maximum of 15 minutes total, including speaking time and discussion. Please be considerable once the Program is completed the next speaker should also be allocated with reasonable amount of time.

2. You can use CD or USB flash drive (memory stick), make sure you scanned viruses in your own computer. Each speaker is required to meet her/his session chair in the corresponding session rooms 10 minutes before the session starts and copy the slide file(PPT or PDF) to the computer. 

3. It is suggested that you email a copy of your presentation to your personal inbox as a backup. If for some reason the files can’t be accessed from your flash drive, you will be able to download them to the computer from your email. 

4. Please note that each session room will be equipped with a LCD projector, screen, point device, microphone, and a laptop with general presentation software such as Microsoft PowerPoint and Adobe Reader. Please make sure that your files are compatible and readable with our operation system by using commonly used fronts and symbols. If you plan to use your own computer, please try the connection and make sure it works before your presentation. 

5. Movies: If your files contain movies please make sure that they are well formatted and connected to the main files.

 

Poster Presentation Instruction

1. Maximum poster size is 59.4 CM wide by 84.1 CM high(A1). 

2. Posters are required to be condensed and attractive. Information should be visible in certain distance-1 meter apart.

3. Please note that during your poster session, the author should stay by your poster to explain and discuss your paper with visiting delegates.


▶▶Registration

For the publication on conference proceedings:

ItemsRegistration Fee
Regular Registration for Paper (4 pages)

500 USD/per paper (4 pages)

3200 CNY/per paper (4 pages)

Manuscript numbers ≥ 3

450 USD/ per paper (4 pages)

2900 CNY/per paper (4 pages)

Extra Pages (Begin at Page 5)

50 USD/ per extra page

300 CNY/per extra pag

Attendees without Submission

180 USD/per person

1200 CNY/per person

Attendees without Submission (Groups)

150 USD/per person(≥ 3 person)

1000 CNY/per person(≥ 3 person)

Purchase Extra Journal75 USD/book

500 CNY/book


▶▶CONTACT INFORMATION

The Secretary office of  ICMEAAE 2022 will collect contributions and finish daily organizing work. All paper review process will be completed by Program Committee Member and invited experts.

If you have any question or inquiries, please feel free to contact us.


Conference Secretary: MS. Chen

E-mail: icmeaae@163.com

Tel: +86-18078840710 (WeChat)

QQ: 2048654005

Contents

  • Conference details
  • Recent Participants
  • Recommended References
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