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2026 International Conference on Semiconductor Materials and Advanced Integrated Circuit Technology(SMAICT2026)

The 2026 International Conference on Semiconductor Materials and Advanced Integrated Circuit Technology (SMAICT 2026)


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Conference Website: www.smaict.com     

Conference Date: October 23-25, 2026

Location: Chongqing, China


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The 2026 International Conference on Semiconductor Materials and Advanced Integrated Circuit Technology (SMAICT 2026) will be held in Chongqing, China, from October 23 to 25, 2026. The conference is sponsored by Chongqing University of Posts and Telecommunications., this conference serves as a premier global event dedicated to advances in semiconductor materials and integrated circuit technology.

With the rapid evolution of semiconductor industries and increasing demands for high-performance, energy-efficient, and miniaturized electronic systems, challenges such as material limitations, device integration complexities, and manufacturing innovation have become critical bottlenecks. Against this backdrop, SMAICT 2026 aims to create a high-level academic and industrial exchange platform to foster cutting-edge research collaboration, bridge gaps between theoretical development and practical applications, and accelerate technological breakthroughs.

The conference will feature keynote speeches, invited talks, oral and poster presentations covering topics including semiconductor materials, device fabrication, integrated circuit design, advanced packaging, and emerging technologies. By bringing together renowned scholars, experts, and industry leaders from universities, research institutions, and enterprises worldwide, SMAICT 2026 will promote interdisciplinary communication and innovation.

SMAICT 2026 is striving for indexing in major databases such as EI Compendex and Scopus and is expected to attract hundreds of participants globally. The conference not only offers a vibrant forum for presenting the latest scientific achievements but also provides opportunities for networking, collaboration, and industry-academia synergy.

We warmly invite researchers, engineers, and industry practitioners worldwide to submit abstracts and manuscripts, participate actively, and contribute to shaping the future of semiconductor materials and integrated circuit technology.
We are pleased to invite you to submit an abstract/manuscripts to present your work in this important scientific event. Previous proceedings were both indexed by EI Compendex and Scopus.


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Track 1 : Semiconductor materials and process technology

Development of new semiconductor materials

Nanomaterials and Two-dimensional Materials Applications

Characterization technology of semiconductor materials

Crystal growth and material preparation

Material Defects and Interface Engineering

Functional Materials and Composite Materials

Advanced deposition and etching process

Wafer processing and manufacturing technology

Reliability and Failure Analysis of Materials

Application of Material Innovation in Semiconductor Devices...
 

Track 2 : Integrated circuit design and manufacturing technology

Advanced process node design method

Low power integrated circuit design

High performance digital and analog circuits

RF and mixed signal integrated circuits

Three-dimensional integration and heterogeneous integration technology

Testing, Validation and Manufacturing Process Control

Chip packaging and interconnection technology

Reliability design of integrated circuits

Quantum devices and future integrated circuits

New integrated circuit architecture


Track 3 : Advanced Semiconductor Applications and System Integration

The Application of Semiconductor Devices in Artificial Intelligence

Internet of Things and Intelligent Sensing Systems

Power Electronics and Energy Management Systems

Emerging Semiconductor Devices and Systems

Application of integrated circuit in communication technology

System-on-Chip ( SoC ) design and implementation

Intelligent manufacturing and semiconductor industry automation

The application of semiconductor technology in automotive electronics

Advanced test technology and system verification

Semiconductor industry chain and technology trends

...


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All papers submitted to SMAICT 2026 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.


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1. The submitted papers must not be previously published or under consideration of publication elsewhere.

2. Please send the full paper(word+pdf) to Submission System.

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3. And please submit the full paper if both the presentation and publication are needed.

4. Please submit the Abstract only if you just want to make a presentation.

5. Templates Download.

6. Should you have any questions, or you need any materials in English, please contact us.


Note: 

(1) Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is made.

(2) All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.


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ItemsRegistration Fee
Regular Registration(4 pages)

570 USD/ paper (4 pages)

3800 CNY/ paper (4 pages)

Extra Pages (Begin at Page 5)

60 USD/ extra page

400 CNY/ extra page

Attendees without a Submission

225 USD/ person

1500 CNY/ person

Attendees without a Submission (Groups)

180 USD/ person(≥ 3 person)

1200 CNY/ person(≥ 3 person)

Purchase Extra Proceedings/Journal copies

75 USD/book

500 CNY/book


* If your paper is accepted by committee and you registered for the conference, a 30% processing fee will be deducted if a retraction is requested.


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※Details of the registration fees

1. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.

2. The registration fee does not include:  

   • Accommodation

   • Visa application fee

   • Transportation fare

3. At least one author for each accepted final paper must pre-register. 

4. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.

5. If you cannot attend the conference due to some reasons, we will post the print proceedings to you together with the payment receipt/Fapiao. 


※Refunds Policy

If the participants request cancellation and refund due to personal reasons, the following refund policy applies.

* 60 days ahead of the conference: 70% of payment refund

* 30-60 days ahead of the conference: 50% of payment refund

* Within 30 days ahead of the conference: 30% of payment refund

* After conference: no refund

Cancellation and refund request must be made formally by email.

The organizing committees reserves the right to change the dates and place of the conference due to force majeure. Losses thus incurred from the force majeure events shall not be liabled and refunds policy shall not apply as well.

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  • October 23, 2026:

    14:00-17:00,Conference Registration & Materials Collection

  • October 24, 2026:

    08:30-09:00  Pre-conference Registration&Check-in;

    09:00-12:00  Keynote Speeches;

    12:00-14:00  Lunch;

    14:00-17:00  Oral Presentations;

    17:00-17:30  Conference Closing;

    17:30-19:30  Banquet

  • October 25, 2026:

    09:00-12:00   Academic Visit


Note: A more detailed programme will be emailed to registered participants after the registration deadline. Actual time arrangement may be adjusted slightly according to the number of participants.



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