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2025 International Conference on Advanced Semiconductor Devices and Integration Technology (ASDIT 2025)

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Conference Website: www.asdit.org

Conference Date: September 19-21, 2025

Location: Wuxi, China


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2025 International Conference on Advanced Semiconductor Devices and Integration Technology (ASDIT 2025) willbe held from September 19 to 21, 2025, in Wuxi, Jiangsu, China. This conference aims to bring together top scholars, industry experts, and business leaders from around the world in the semiconductor field to discuss the latest research findings and technological advancements. The conference will cover the design, manufacture, materials, and innovations of advanced semiconductor devices in various applications, including cutting-edge technologies such as artificial intelligence, quantum computing, and 5G communications. Participants will have the opportunity to attend keynote speeches, special discussions, and technical exhibitions, gaining insights into industry trends and sharing frontier experiences.

We sincerely invite experts and scholars from around the globe to participate in this grand event, working together to advance the progress and development of semiconductor technology. We look forward to meeting you in Wuxi and exploring the infinite possibilities of future technologies together!


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· New Semiconductor Materials and Their Applications in Devices

· High-Performance MOSFET Design and Optimization

· Power Device Technologies for Energy Efficiency Optimization

· III-V Compound Semiconductor Devices Beyond Silicon

· Micro-Optoelectronic Semiconductor Sensors and Their Applications

· Semiconductor Lasers and Their Emerging Application Areas

· Graphene and Other Two-Dimensional Material Devices

· Quantum Dot and Quantum Well Semiconductor Devices

· Novel Memory Devices: RRAM, MRAM, FeRAM

· Challenges and Opportunities in Low-Temperature Electronic Devices

· Breakthrough Technologies for High-Frequency and High-Power Devices

· Silicon-Based Optoelectronic Devices and Their Integration Technologies

· Research on Tunnel Field-Effect Transistor (TFET) Devices

· Reliability and Aging Mechanisms of Semiconductor Devices

· Impact of Advanced Packaging and Interconnection Structures on Device Performance

· Three-Dimensional Integrated Circuits and Their Manufacturing Processes

· System on Chip (SoC) and Integration Methods

· Chip Heterogeneous Integration Technology

· Development and Innovation in Package-Level Integration Technologies

· Thermal Management Technologies in Integrated Circuits

· Radio Frequency Integrated Circuits and Their Design Optimization

· Applications of Artificial Intelligence and Machine Learning in Integrated Circuit Design

· Advanced Analog and Mixed-Signal Integrated Circuits

· Power Management Integrated Circuit Technologies

· Reliability and Security Challenges in Integrated Circuit Design

· Silicon Photonics Interconnection Technologies

· The Latest Advances in Ultra-Large-Scale Integration Technologies

· Emerging Memory Integration Technologies

· Modular MEMS and NEMS Integration Applications

· Integration and Innovation in Intelligent Sensing Systems


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All accepted full papers will be published in IEEE(ISBN: 979-8-3315-9671-2) and will be submitted to EI Compendex / Scopus  for indexing.


Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.


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1. The submitted papers must not be previously published or under consideration of publication elsewhere.

2. Please send the full paper(word+pdf) to Submission System.

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3. And please submit the full paper if both the presentation and publication are needed.

4. Please submit the Abstract only if you just want to make a presentation.

5. Templates Download.

6. Should you have any questions, or you need any materials in English, please contact us.

yanxiangru@ais.cn


Note: 

(1) Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is made.

(2) All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.


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Registration Fee
ItemPrice
Regular Registration (4 pages)

570 USD/ paper (4 pages)

3800 CNY/ paper (4 pages)

Extra Pages (Begin at Page 5)

60 USD/ extra page

400 CNY/ extra page

Attendees without a Submission

225 USD/ person

1500 CNY/ person

Attendees without a Submission 

(Groups)

180 USD/ person(≥ 3 person)

1200 CNY/ person(≥ 3 person)

Purchase Extra Proceedings

/Journal copies

75 USD/book

500 CNY/book

※Details of the registration fees

1. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.

2. The registration fee does not include:  

   • Accommodation

   • Visa application fee

   • Transportation fare

3. At least one author for each accepted final paper must pre-register. 

4. This conference has set a fixed exchange rate of 100 RMB to 15 USD.

5. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.

6. If you cannot attend the conference due to some reasons, we will post the print proceedings to you together with the payment receipt/Fapiao. 


※Refunds Policy

If the participants request cancellation and refund due to personal reasons, the following refund policy applies.

* 60 days ahead of the conference: 70% of payment refund

* 30-60 days ahead of the conference: 50% of payment refund

* Within 30 days ahead of the conference: 30% of payment refund

* After conference: no refund

Cancellation and refund request must be made formally by email.

The organizing committees reserves the right to change the dates and place of the conference due to force majeure. Losses thus incurred from the force majeure events shall not be liabled and refunds policy shall not apply as well.

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DateTimeActivity
September 1914:00-18:00Sign-in
September 209:00-9:30Opening Ceremony
9:30-12:00Keynote Speech
12:00-14:00Lunch
14:00-18:00

Oral Report

Poster Display

September 219:00-18:00Academic Tour


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Conference Secretary: Candice Yan

Tel: +86-18124945342 (WeChat)

Tel: +86-17817043042 (Whatsapp)

E-Mail: yanxiangru@ais.cn (Candice Yan)

E-Mail: asdit_contact@163.cn

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Wechat OR code

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WhatsApp QR code

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