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标题.pngImportant information

Website: http://www.icmeim.net/

Final Paper Submission Date: July 31 , 2023

Conference Dates: Aug. 4-6, 2023

Notification of Acceptance Date: Within one week of submission

Index: EI Compendex, Scopus


标题.pngAbout MEIM 2023

The 4th International Conference on Mechanical Engineering and Intelligent Manufacturing (MEIM 2023) is scheduled to be held in Dalian, China from Aug. 4 to 6, 2023. This conference will focus on research areas such as mechanical engineering and intelligent manufacturing. The aim of the discussion is to provide a platform for experts, scholars, engineering and technical personnel, and technical research and development personnel engaged in mechanical engineering and intelligent manufacturing to share scientific research results and cutting-edge technologies, discuss academic development trends, broaden research ideas, and promote the industrialization of academic achievements. Meanwhile, the conference is also a desirable platform for participants to expand professional connections and network, and build international partnerships with others. 


We sincerely welcome experts and scholars at home and abroad, business people, and other interested individuals to participate in the conference and exchange!


标题.pngPublication

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings and submitted to EI Compendex, and Scopus for indexing.


标题.pngOrganizer






标题.pngSpeaker 

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Prof. Ka-Veng Yuen (H-Index: 44)

State Key Laboratory of Internet of Things for Smart City, University of Macau, China

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Prof. Na Li

Xidian University, China

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Prof. Kun Li

Chongqing University, China


标题.pngTopics

标题.pngProgram

标题.pngRegistration Fee

标题.pngSubmission

标题.pngContact us

Conference Secretary: Candice Yan

E-mail: aeicmeim@163.com

Tel: +86-18124945342 (WeChat)

QQ: 3523162311

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Contents

  • Conference details
  • Recent Participants
  • Recommended References
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